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Thin Film Process Development Engineer (Writer)

Company: Headway Technologies, Inc.
Location: Milpitas
Posted on: January 16, 2022

Job Description:

JOB DESCRIPTION TITLE: THIN FILM PROCESS DEVELOPMENT ENGINEER (WRITER) FLSA STATUS: EXEMPT REPORTS TO: DIRECTOR, THIN FILM PROCESS DEVELOPMENT ENGINEERING SUMMARY: Under the direction of the Director of Thin Film Process Development Engineering, the Thin Film Process Development Engineer is responsible for developing, monitoring, sustaining, and supporting advanced writer film, PMR, TAMR or other sensor processes for new and prototype products; designing and conducting advanced wafer experiments, analyzing the data, and reporting the results; developing and implementing new practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; developing and implementing procedures for transitioning new products into the production line; and reviewing, updating, and maintaining documentation and process instructions. This position is located in Milpitas, California. ESSENTIAL FUNCTIONS:Develops, sustains, and supports advanced thin film processes for new and prototype products; develops and implements novel approaches to improve and optimize PMR, TAMR and advanced writer processesDevelops and implements practices or methodologies which reduce cost and improve operational efficiencyConducts root cause analysis and implements corrective action if requiredDevelops and implements processes or procedures for transitioning new products into the production lineResolves process issues related to material selection; recommends corrective actionReviews, updates, and maintains documentation and process instructionsInstructs operators and technicians on processes and procedures, including modifications to existing proceduresPartners with equipment and maintenance personnel in order to minimize tool down time and integrate new tools into the production lineDesigns and conducts advanced experiments, analyzes data, and develops recommendations for improving the performance or reducing cost based on test resultsPartners with other groups and departments, including process and product engineering to develop and implement new processes which reduce scrap and improve yieldResponds to inquiries from other team members, managers, or departmentsAdheres to all safety policies and procedures as requiredPerforms other duties of a similar nature or level MINIMUM QUALIFICATIONS:Master's degree in Electrical Engineering, Materials Science, or Physics, and/or equivalent relevant experience; PhD preferredFive years of hands' on experience in PVD/IBD/CVD/ALD/PECVD technologyStrong industry experience working in the magnetic recording head, hard disk drive, or semiconductor industry in a thin film process development engineering roleStrong knowledge and experience using JMP, SPC, or similar softwareProficient in the use of Microsoft Office Applications Knowledge, Skills, and Abilities:Strong knowledge and experience of PVD, IBD, CVD, ALD, PECVD processes in PMR, TAMR, and other writer areaStrong knowledge and hands-on experience of thin film manufacturing processes, practices, and techniquesStrong knowledge of wafer fabrication processing techniques and tools such as PVD, IBD, CVD, ALD, and PECVDKnowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentationsAble to design experiments, analyze results, and recommend corrective action in order to reduce scrap and improve yieldAble to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvementsAble to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and managementAble to work productively and collaboratively with all levels of employees and managementAble to comply with all safety policies and proceduresDemonstrated organizational and time management skillsDemonstrated problem-solving and trouble shooting skillsFlexible and able to prioritize WORKING CONDITIONS: Thin Film Process Development Engineer works primarily in an office environment from Monday to Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from site-to-site as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards (wears a bunny suit). May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally push, pull, or lift 20 or more pounds. Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting. TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, sex, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.

Keywords: Headway Technologies, Inc., Milpitas , Thin Film Process Development Engineer (Writer), Engineering , Milpitas, California

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