Optical Packaging Engineer- Flip Chip Assembly- 2.5D Packaging

Company: CyberCoders
Location: Milpitas
Posted on: July 29, 2022

Job Description:

If you are a Optical Packaging Engineer- Flip Chip Assembly- 2.5D Packaging with experience, please read on!What You Will Be Doing(THIS POSITION REPORTS TO THE MILPITAS AREA OF CALIFORNIA AND REQUIRES RELOCATION, PARTIAL REMOTE ALLOWED)The Package Engineering function provides support, expertise, and insight to the Silicon device development team through preliminary activities of package selection, routing techniques and necessary simulation work. The position involves diverse responsibilities, including evaluation of new packaging technology, package recommendation for custom devices, substrate design support, device/package qualification. You will be working very closely with Package Design/Manufacturing team in our headquarter and customers in USA. Also, you will be working very closely with Marketing and Engineering teams located in our Santa Clara office during pre/post sales process.The Director position requires experience in the Fabless semiconductor model with a broad knowledge of package technology and manufacturing. Successful candidates will have a deep understanding of a variety of IC package technologies. Candidate should possess specific experience in the following areas: high performance build-up substrates, flip chip assembly or 2.5D packaging. Knowledge of Chiplet technology, Optical integrated packages and also experience in extracting/simulating package designs for SI and PI using tools such as HFSS, POWER SI and other leading tools.QualificationsEducation" Bachelors degree in Electrical Engineering, or other semiconductor packaging related disciplineRequired Experience And Skills" 10 years of experience in semiconductor packaging design and simulations" Record of success in cross-functional team environment" Good experience with SI/PI tools for package level extraction/simulation" Ability to work with Package Layout engineers" Strong presentation and communication skillsPreferred Experience And Skills" Good knowledge of IC package materials and manufacturingWhat You Need for this Position

• Optical Packaging Engineer
• Flip Chip Assembly
• Optical Engineer
• 2.5D Packaging
• Packaging Engineer
• Chiplet technology
• semiconductor packaging design
• Simulations
• IC package materialsSo, if you are a Optical Packaging Engineer- Flip Chip Assembly- 2.5D Packaging with experience, please apply today!Email Your Resume In Word ToLooking forward to receiving your resume through our website and going over the position with you. Clicking apply is the best way to apply, but you may also:Jonathan.Gilmor@CyberCoders.com
  • Please do NOT change the email subject line in any way. You must keep the JobID: linkedin : JG6-1696642 -- in the email subject line for your application to be considered.***Jonathan Gilmor - Recruiting Manager - CyberCodersApplicants must be authorized to work in the U.S.CyberCoders, Inc is proud to be an Equal Opportunity EmployerAll qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, protected veteran status, or any other characteristic protected by law.Your Right to Work - In compliance with federal law, all persons hired will be required to verify identity and eligibility to work in the United States and to complete the required employment eligibility verification document form upon hire.

Keywords: CyberCoders, Milpitas , Optical Packaging Engineer- Flip Chip Assembly- 2.5D Packaging, Engineering , Milpitas, California