Optical Packaging Engineer- Flip Chip Assembly- 2.5D Packaging
Company: CyberCoders
Location: Milpitas
Posted on: July 29, 2022
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Job Description:
If you are a Optical Packaging Engineer- Flip Chip Assembly-
2.5D Packaging with experience, please read on!What You Will Be
Doing(THIS POSITION REPORTS TO THE MILPITAS AREA OF CALIFORNIA AND
REQUIRES RELOCATION, PARTIAL REMOTE ALLOWED)The Package Engineering
function provides support, expertise, and insight to the Silicon
device development team through preliminary activities of package
selection, routing techniques and necessary simulation work. The
position involves diverse responsibilities, including evaluation of
new packaging technology, package recommendation for custom
devices, substrate design support, device/package qualification.
You will be working very closely with Package Design/Manufacturing
team in our headquarter and customers in USA. Also, you will be
working very closely with Marketing and Engineering teams located
in our Santa Clara office during pre/post sales process.The
Director position requires experience in the Fabless semiconductor
model with a broad knowledge of package technology and
manufacturing. Successful candidates will have a deep understanding
of a variety of IC package technologies. Candidate should possess
specific experience in the following areas: high performance
build-up substrates, flip chip assembly or 2.5D packaging.
Knowledge of Chiplet technology, Optical integrated packages and
also experience in extracting/simulating package designs for SI and
PI using tools such as HFSS, POWER SI and other leading
tools.QualificationsEducation" Bachelors degree in Electrical
Engineering, or other semiconductor packaging related
disciplineRequired Experience And Skills" 10 years of experience in
semiconductor packaging design and simulations" Record of success
in cross-functional team environment" Good experience with SI/PI
tools for package level extraction/simulation" Ability to work with
Package Layout engineers" Strong presentation and communication
skillsPreferred Experience And Skills" Good knowledge of IC package
materials and manufacturingWhat You Need for this Position
Keywords: CyberCoders, Milpitas , Optical Packaging Engineer- Flip Chip Assembly- 2.5D Packaging, Engineering , Milpitas, California
Click
here to apply!
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